凯发

The need for faster, smaller, more reliable and more efficient electronic consuming products has resulted in more and more heat generated in microelectronic components. The thermal management has become an important and severe issue as this can result in serious reliable problems. In this talk, some 2D materials applied as heat spreader for microelectronics cooling applications are presented, including horizontal and vertical graphene structures and hexagonal boron nitride. Firstly, the graphene heat spreader developed by monolayer and multilayer graphene was obtained and the thermal performance of the graphene heat spreader was also studied for different packaging structures, including wire bonding, heat transfer using cooling fin and flip chip. Secondly, the 2D h-BN spreader fabricated by different methods and its heat dissipation performance were characterized by different thermal characterization methods, such as RTD and IR method. Finally, the vertical aligned graphene based structure(Carbon Nanowall) developed by PECVD was also studied, and its thermal performance was also reviewed. In conclusion, these developed 2D new novel materials have potentially promising applications for microelectronics cooling applications.