Dr. Daping He, Professor at Wuhan University of Technology, holds a Ph.D. in Engineering. He has been selected for the National High-Level Talent Program and currently serves as the Vice Dean of the School of Physics and Mechanics.
Dr. He conducted postdoctoral research successively at the University of Science and Technology of China, the University of Bath in the UK, and the University of Cambridge. Currently, he is the Director of the Hubei Provincial RF Microwave Application Engineering Center and the Director of the Hubei Provincial Macro Graphene Professional Institute.
His main research fields include the regulation and preparation of macro-graphene films and their applications in electronic devices, new energy, and other fields. In 2019, he founded Hanxi Technology Co., Ltd. Currently, graphene-based products from the company have been applied in various areas, including aerospace, 3C electronics, and energy information.
Graphene, with its exceptionally high theoretical thermal conductivity, is an ideal material for thermal management. However, its two-dimensional nature leads to anisotropy in macroscopic films, resulting in a low out-of-plane thermal conductivity. This significantly limits its application in Thermal Interface Materials (TIMs). The parallel stacking structure of traditional graphene films is incompatible with interfacial heat transfer mechanisms, instead increasing thermal resistance and failing to meet the growing demand for efficient thermal management in high-performance electronic devices and energy storage systems.
To address these challenges, Wuhan Hanxi Technology Co., Ltd. is focusing on novel macroscopic graphene film structure design to develop superior performance thermal interface materials. Through in-depth exploration of graphene structure regulation technology, we have successfully developed a series of innovative graphene-based TIMs, including macroscopic graphene heat dissipation films, flexible graphene foams, efficient solid-state vapor chambers, and flexible elastic thermal pads. These products demonstrate significant advantages in enhancing heat conduction efficiency and reducing interfacial thermal resistance, overcoming the limitations of traditional TIMs. By constructing these innovative thermal management solutions, we are committed to providing transformative technological support for heat dissipation issues in key fields such as electronic devices and energy storage, thereby driving technological advancement in related industries.


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E-mail: meeting@c-gia.org
Abstract: Minyang Lu
Sponsor: Wenyang Yang
Media: Liping Wang
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Operated by:China Innovation Alliance of the Graphene Industry