Speaker-Yunbao Zhang
Ms. Yunbao Zhang is one of the founders of the Shenzhen Graphene Research Institute and a senior partner at a central state-owned enterprise. She is a key promoter of innovative venture capital models in the new materials industry.
She currently serves as Chairperson of the Shenzhen Graphene Research Institute and Chair of the Board at Shenzhen Xizuan Technology Co., Ltd.
Previously, Ms. Zhang served as Vice President of Qilin Capital and General Manager of the Post-Investment Management Department. She has over ten years of experience in equity investment and post-investment management in the defense and advanced materials sectors, and more than fifteen years of experience in corporate operations and market development.
2019-Present: Chairperson, Shenzhen Qianhai Graphene Innovation and Technology Research Institute.
2017-Present: Project Director for CMP and Chief Executive Officer (CEO), Beijing Graphene Institute / Shenzhen Xizuan Technology Co., Ltd.
2007-2016: General Manager, Post-Investment Management Department, Qilin Capital / Qilin Fund.
Ms. Zhang has exceptional expertise in strategic sales management and high-value client development, as well as in resource integration and coordination. She has worked with her core team members for no less than five years and up to more than ten years, earning their deep trust and respect.
Chemical–mechanical planarization (CMP) combines chemical reagents with nanoscale abrasive particles to achieve a highly planar wafer surface. It is a core step in integrated circuit manufacturing and the only technology capable of delivering the surface flatness required across chip layers. Without CMP, the topographical variations from each layer would accumulate, ultimately degrading chip yield; absent CMP, wafer processing would be limited to roughly the 350-nm process node.
With the continuous advancement of ultra-large-scale integrated circuit technology, linewidths in chip fabrication are shrinking to ever finer scales and the number of layers is steadily increasing. This trend places increasingly stringent demands on chemical–mechanical planarization (CMP) technology. Against this backdrop, demand for a range of critical CMP consumables — such as polishing pads (pads), slurries, and diamond disks — has grown strongly, resulting in a pronounced supply shortfall.
Shenzhen Xizuan Technology Co., Ltd. is a high-technology company focused on achieving domestic self-reliance in CMP consumables for semiconductor chips, dedicated to the research, manufacture, and systematic integration of diamond disks, polishing pads, and polishing abrasives. As the only domestic provider covering the full range and entire lifecycle of CMP consumables, the company is centered on a “one-core, two-wings” flywheel strategy: the core is a process database together with a design-and-manufacturing platform that consolidate the company’s proprietary know-how; the left wing targets the semiconductor and adjacent markets to enable large-scale deployment; and the right wing provides CMP consumable validation services to build an ecosystem and enhance value.
Diamond disks, polishing pads, and polishing abrasives form a closed-loop flywheel: service delivery generates data, the data optimizes solutions, superior solutions attract customers, and customer adoption in turn reinforces platform barriers and drives sustained, self-reinforcing business growth.
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