Hailong ZhangUniversity of Science & Technology Beijing, China
Zhang Hailong holds a PhD degree of materials science in Xi’an Jiaotong University in 2003, and is currently a professor at the State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing. He has visited Technical University of Darmstadt, Germany and La Trobe University, Australia for research. His research field includes metal matrix composites of high thermal conductivity, thermal management materials, electronic packaging materials, and functional ceramics. He has been funded by national projects like “863” and Natural Science Foundation of China (NSFC). He has published more than 110 articles on materials journals including Acta Mater, Scripta Mater, and Phys Rev B. These articles have been cited by other researchers for over 900 times.
Title：Thermal conductivity of diamond/Cu-Ti composites produced by gas pressure infiltration
SymposiumB12 Metallic Composite
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Abstract
The miniaturization of electronics is urgently demanding packaging materials with superior thermal conductivity. As a promising candidate, diamond particles dispersed copper matrix (diamond/Cu) composites are attracting more and more interests. Because of large contact angel between diamond and Cu, poor interfacial bonding becomes a main obstacle to obtaining high thermal conductivity in the diamond/Cu composites. Here we add a strong carbide-forming element of Ti to Cu matrix with an attempt to connect diamond reinforcements with metal matrix tightly, and apply a novel process of gas pressure infiltration to consolidate the composites. We demonstrate the enhancement of thermal conductivity by such Ti addition. A high thermal conductivity of 752 W/mK is obtained in the diamond/Cu-Ti composites.
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