凯发

With increased power densityand continued miniaturization, effective thermal dissipation is of significantimportance for operational lifetime and reliability in electronic applications.Thermal management, therefore, becomes a critical issue for next generation ofelectronics. This scenario motivates development of novel thermally conductiveadhesive (TCA) with enhanced thermal conductivity. Due to its atomic structurewith sp2 hybrid orbitalsand unique electronic properties, graphene has an extraordinarily high thermalconductivity which has been reported to be up to 5000 W/mK. As aconsequence, the use of graphene-based materials for thermal management hasbeen subject to substantial attention during recent years in both academia andindustry. Recently it was reported that graphene exhibit superior thermalconductivity even when they are incorporated with matrix materials, whichoffers a potential to develop high thermal conductive graphene-filled compositematerials. In this work, a new functionalized graphene and its filled TCA hasbeen developed and characterized. Starting from pristine graphite flakes,graphene was prepared through chemical exfoliation and functionalized with anano silver layer to form a special metal/graphene hybrid material. Moreover,an efficient method to uniformly disperse the nano-scaled graphene hybridmaterial in silver-epoxy matrix was developed. Thermal characterization throughLaser-flash equipment has indicated that a significant thermal conductivityimprovement was achieved through adding functionalized graphene into thematerial. Different TCA samples with various weight percentages offunctionalized graphene were prepared and tested to study thermal conductivity.Data show that a thermal conductivity value of 7.6 W/ m K is reached when thegraphene/silver percentage is 11.5 % that is almost 4 times higher than thereference material.