Speaker-Johan Liu

Johan Liu
Chalmers University of Technology, Sweden

Professor Johan Liu graduated with a master and Ph.D degree in Materials Science and Engineering from the Royal Institute of Technology, Stockholm, Sweden in 1984 and 1989 respectively. He served in various positions at the Swedish Institute for Production Research (IVF),Gothenburg as project manager, group leader and division manager between 1989 and 1999. He is since then a professor in electronics production, Chalmers University of Technology, Sweden and a specially recruited professor (short term) at Shanghai University. As a member of the Royal Swedish Academy of Engineering Sciences, a Fellow of IEEE and a member of the European Nanoelectronics Association (Aeneas), he has published 2 books, 480 papers in journals, conference proceedings and 15 book chapters with a Hirsch index of 38 and with a citation of over 5600 times. He has over 60 patents accepted or filed and has given 50 keynote/invited talks during the last 20 years. In addition, he has also received many awards including IEEE CPMT Exceptional Technical Achievement Award, IEEE CPMT Transaction Best paper Award in“Advanced Packaging”. He also serves on the Scientific Advisory Board forHenkel, Pacific Region.


Title:A critical assessment of using graphene as heat spreader and thermal management material– Bottom necks and future development challenges
SymposiumElectronic Devices
Starting Time
Ending Time
Abstract

Graphene, due to itsexceptional mechanical, optical, electrical, physical and thermal properties,has attracted strong interest for both fundamental studies and realapplications. Among all these properties, the extraordinary high in-plane thermalconductivity makes graphene an ideal heat spreading and thermal management materialfor power devices and systems. This talk presents a critical assessment of the state of the art of usinggraphene in heat spreader and thermal management applications. The talk coversresearch and development status on graphene enhanced thermally conductiveadhesive, highly thermal conductive graphene film, thermal characterizationmethods and functionalization challenges. Special attentions are paid on thebottom necks and future challenges for commercialization.

Main Organizer

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E-mail: meeting@c-gia.org

Abstract: Minyang Lu

Sponsor: Wenyang Yang

Media: Xiaoyan Zhang

Visa: Xiaoqing Huang

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